Application of Total-reflection X-ray Fluorescence Analysis
-
摘要: 近年来,全反射X荧光分析技术获得突破性进展.从表面及近表层微量、超微量元素分析发展到结构、深度及深度分布的探测.其检测限已达pg级,硅片杂质检测限达108atoms/cm2.文章介绍了该技术的基本理论、特点、国内外最新发展情况及对其今后发展的展望. In recent years a remarkable development has been achieved in total-reflection X-ray fluorescence (TXRF) analysis techniques. The trace and ulera-trace analysis of elements has been made out from surface and near-surface layer to depth and depth profiling as well as layered structures. Absolute detectoion limits has come to pg-level and the least detection limits of 108atoms/cm2 can be reached for surface contamination on St wafers. The basic theory, characteristic, recent...Abstract: In recent years a remarkable development has been achieved in total-reflection X-ray fluorescence (TXRF) analysis techniques. The trace and ulera-trace analysis of elements has been made out from surface and near-surface layer to depth and depth profiling as well as layered structures. Absolute detectoion limits has come to pg-level and the least detection limits of 108atoms/cm2 can be reached for surface contamination on St wafers. The basic theory, characteristic, recent...
-
Key words:
- total-reflection /
- glancing angle /
- detection limits /
- trace analysis
计量
- 文章访问数: 1549
- HTML全文浏览量: 60
- PDF下载量: 420
- 被引次数: 0